Fluid-cooled heat sink with turbulence-enhancing support pins
US6729383B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1999 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Dec 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occupied by the pins, the fluid thereby being agitated by the pins. Frequent inventive practice attributes the pins with supportability of the entity. The pins can be made to be thermally nonconductive, the heat transfer thus being primarily founded on thermally convective principles involving the cooling fluid, the invention thus being effective in the absence of significant heat conduction from the entity to the heat sink. Typical inventive practice prescribes that a given array is patterned in an orderly fashion, all pins therein are parallel and each pin therein has the same cross-sectional geometry; however, there can be disparity between or among pins in any or all such respects. A pin's cross-sectional geometry can describe any shape—rectilinear, curvilinear or some combination thereof. The configurational regularity of the pins promotes the uniformity of heat transference from the entity…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.