Bonding tool with polymer coating
US6729527B2 · kind B2 · utility
28Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jan 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.