Transparent substrate and hinged optical assembly
US6729776B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Aug 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4691
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus are provided for providing an electro-optic signal processing assembly. The method includes the steps of providing an optically transparent substrate with a plurality of alignment apertures formed in the substrate, disposing a guide pin in each of the plurality of alignment apertures, providing an optical device with a transmission path of the optical device passing directly through the body of the optically transparent substrate, aligning an optical fiber holder to the optical device using the guide pins and guide pin apertures, and coupling an optical signal of the optical device of the optical array to a respective optical fiber of the aligned optical fiber holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.