Semiconductor wafer handler
US6729947B1 · kind B1 · utility
7Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Nov 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.