Patent · US Expired

Methods and devices for sealing microchip reservoir devices

US6730072B2 · kind B2 · utility

97Cited by
55References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 30, 2001
Grant dateMay 4, 2004
Priority date
Expiry dateNov 21, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB01L2300/0819
  • WIPO fieldPharmaceuticals
  • WIPO sectorChemistry

Abstract

Methods and devices are provided for mechanically sealing the reservoirs of microchip devices to prevent leakage from or between any of the reservoirs. In one embodiment, the method includes sandwiching a microchip device and a gasket material covering the reservoir openings between a front sealing frame and a backplate, such that the gasket material is compressed against the back side of the microchip device by the back plate. The front sealing frame is secured to the back sealing plate using fasteners or welding. The gasket material is preferably a flexible polymeric sheet, which is biocompatible and compatible with the reservoir contents. In another embodiment, a composite backplate is used in place of the back sealing plate and separate gasket material. The composite backplate can include a substrate having sealing plugs defined thereon. The composite backplate also can be designed to hold the drug, thereby combining the assembly steps of reservoir filling and sealing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.