Oblique deposition apparatus
US6730197B2 · kind B2 · utility
18Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An oblique sputtering deposition apparatus is provided for preparing a thin film. A collimator having angled passages for filtering out particles from stray directions is placed between the substrate and the incident particle flux. The angle of the passages can be adjusted from about 0 to about 90° with respect to the substrate normal according to requirements. The oblique incidence of particle flux brings forms a column structure which is also angled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.