Focused ion beam process for removal of copper
US6730237B2 · kind B2 · utility
11Cited by
13References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jul 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for milling copper metal from a substrate having an exposed copper surface includes absorbing a halogen gas onto the exposed copper surface to generate reaction products of copper and the halogen gas; removing unreacted halogen gas from the surface; and directing a focused ion beam onto the surface to selectively remove a portion of the surface comprising the reaction products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.