Patent · US Expired

Method of manufacture of resin block

US6730255B2 · kind B2 · utility

0Cited by
22References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 17, 2003
Grant dateMay 4, 2004
Priority date
Expiry dateJun 17, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01B17/64
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method for manufacture of a resin block includes setting high-voltage and low-voltage side conductors in dies, assembling the dies, extruding resin so as to form a resin block having the high-voltage side conductor and the low-voltage side conductor embedded therein, cooling the molded resin block, and taking out the molded resin block from the dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.