Promoting adhesion between a polymer and a metallic substrate
US6730409B1 · kind B1 · utility
1Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1999 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.