Manufacturing system in electronic devices
US6730447B2 · kind B2 · utility
9Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jul 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus comprises a laser oscillator for producing a laser beam to selectively remove part of a substrate to be processed, a scanning system for applying the laser beam to an arbitrary position of the substrate and incident means for applying the laser beam to the substrate substantially at right angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.