Semiconductor light emitting element formed on a clear or translucent substrate
US6730530B2 · kind B2 · utility
2Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.