Plastic packaging of LED arrays

US6730533B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Kevin Matthew Durocher · Cohoes, US
• Ernest Wayne Balch · Malta, US
• Vikram Krishnamurthy · Latham, US
• Richard Joseph Saia · Niskayuna, US
• Herbert S. Cole, Jr. · Scotia, US
• Ronald Frank Kolc · Cherry Hill, US

Key dates

• Filing date: Mar 14, 2003
• Grant date: May 4, 2004
• Expiry date: Mar 14, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49171
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.