Techniques for connecting a lead to a conductor
US6730848B1 · kind B1 · utility
18Cited by
51References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jun 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49181
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.