Electronic assembly and a method of constructing an electronic assembly
US6730860B2 · kind B2 · utility
12Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Sep 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.