Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device
US6730997B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer.The method may be used to form a stack of dies (4, 14 . . . ) which are adhered together by cured polymeric layers (7, 17). Each die (4, 14 . . . ) may include a device layer and an ultra-thin substrate manufactured and assembled by the method described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.