Integrated circuit mounting system with separate loading forces for socket and heat sink
US6731505B1 · kind B1 · utility
13Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting system for an integrated circuit employs a novel load cell having a backing plate, a bow spring and a load distribution plate. The load cell controls the loading forces on contacts of an integrated circuit socket. A heat sink having a base includes a pedestal extending from the base that abuts the integrated circuit for purposes of heat removal. Springs are employed to provide loading forces for the heat sink that are lower than the loading forces for the integrated circuit socket contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.