Electronic module assembly apparatus, methods and articles of manufacture
US6733306B2 · kind B2 · utility
4Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Aug 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/306
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus, methods and articles of manufacture for electronic module assemblies are shown, comprising a pin organizer installed after a header is assembled to a module. Opposing forces tension the organizer, header and module assembly, so as to provide a relatively fixed anchor for the header upon the module, as well as providing orientation for the module and support for a pin array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.