Patent · US Expired

Method and apparatus for polishing or lapping an aspherical surface of a work piece

US6733369B1 · kind B1 · utility

19Cited by

2References

12Claims

0Family size

Assignee

Carl Zeiss Semiconductor Manufacturing Technologies AG · DE

Inventors

Siegfried Stacklies · Aalen, DE
Yaolong Chen · Aalen, DE

Key dates

Filing date	Sep 30, 2002
Grant date	May 11, 2004
Priority date	—
Expiry date	Sep 30, 2022

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23Q1/5406
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for polishing or lapping an aspherical surface of a work piece comprises a tool rotatable about an axis, the working surface area of the tool being smaller than the work piece, and an arrangement by means of which the tool and the work piece are adjustable relative to each other in all three directions in space, by means of which the orientation of the tool relative to the work piece is adjustable about at least two axes, and by means of which the work piece is rotatable about an axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.