Microwave assisted bonding method and joint
US6734409B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Dec 21, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/73921
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of bonding together first and second components and a joint are provided. The method includes the steps of applying a film coating of electrically conductive material to an adjoining interface of a first component surface of the first component and a second component surface of the second component. The film coating has a thickness of less than 200 nanometers. The method also includes the step of positioning the first and second components such that the film coating is disposed between the first and second component surfaces. The method further includes the step of irradiating microwave energy to the film coating to generate thermal energy on the film coating to bond together the first and second components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.