Flip-chip device strengthened by substrate metal ring
US6734567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic devices of improved reliability having a substrate of electrically insulating material, further an integrated circuit chip with a periphery and a surface. Using a layer of polymeric material, the chip surface is mounted on the substrate surface. The polymeric material protrudes beyond the chip periphery and spreads some distance along the substrate surface. A metal layer is on the substrate surface, this layer is shaped as a band around the chip periphery; the band has an inner edge near the chip periphery, and an outer edge near the contour of the polymer protrusion. This metal band serves as a guard ring to stop any nascent crack propagating in the polymer protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.