Surface acoustic wave device and manufacturing method thereof
US6734605B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Feb 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention provides a surface acoustic wave device and a manufacturing method thereof which enhances reliability and yield. A surface acoustic wave device having a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element is provided with a first substrate, which has a first connecting terminal having a first hollow component formed therewith including an opening that accommodates an electronic component and electrically connecting to the electronic component formed in the first hollow component, and a second connecting terminal formed in the vicinity of the opening and electrically connecting to the first connecting terminal, a second substrate where one face side is joined to the opening of the first substrate and the surface acoustic wave element is electrically connected to the second connecting terminal on the other face side, and a cap which is joined to the first substrate and has a second hollow component that hermetically seals the surface acoustic wave element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.