Inductive sensor having a sensor coil in the form of a structured conductive layer
US6734665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Sep 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In order to so improve an inductive sensor comprising at least one sensor coil in the form of a structured, conductive layer of a carrier board, and an evaluation circuit comprising a printed circuit board with conductor tracks provided thereon and being connected to the sensor coil, that it is manufacturable as cost-efficiently as possible, it is proposed that the carrier board carrying the sensor coil be mechanically rigidly and electrically connected to the printed circuit board by at least two soldered joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.