Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
US6735084B1 · kind B1 · utility
12Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2003 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | May 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly each equipped with the heat sink includes a base portion fixedly attached to a circuit board, a contact portion fixedly and tightly brought into contact with one or more electronic devices, and a plurality of heat radiation fins each extended from the contact portion to a certain distance. A heat radiation fin distant from the base portion has a width shorter than of a heat radiation fin nearer to the base portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.