Concatenation detection across multiple chips
US6735197B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04J3/1611
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for detecting concatenation of payload data for an communication circuit is disclosed, wherein the payload data is dispersed over a first integrated circuit and one or more subsequent integrated circuits. The method and apparatus include determining whether each of the one or more subsequent integrated circuits have all channels therein designated as concatenation slaves, and communicating the determination to the first integrated circuit, the determination indicating that the one or more subsequent integrated circuits. According to an embodiment, the method and apparatus further include coupling the first integrated circuits to the one or more subsequent integrated circuits. The apparatus and method further include detecting concatenation on a first integrated circuit of the one or more integrated circuits, assigning one or more bi-directional ports coupled to the first integrated circuit as an input port, assigning each bi-directional port coupled to the one or more subsequent integrated circuits as output ports, and if any one integrated circuit among the subsequent integrated circuits includes a channel therein designated as a slave channel, providing an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.