Manufacturing method for an electronic apparatus and electronic apparatus with plastic housing
US6735858B1 · kind B1 · utility
7Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2000 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Mar 15, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing an electronic apparatus having a plastic housing. The method includes blow molding with a one-piece plastic housing around an electronic circuit board populated with components. The circuit board is fastened and held in-situ during the blow molding. Fastening locations are defined by contiguously sandwiched portions of the housing and the electronic circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.