Flexible circuit board and method of fabricating the same
US6735865B2 · kind B2 · utility
5Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Apr 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.