Optically interconnecting integrated circuit chips
US6736552B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Apr 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical optical waveguide channel is formed in an intermediate layer of a printed circuit board (PCB) so that opto-electronic components on integrated circuit (IC) chips mounted on the PCB may be optically interconnected. At each end of the optical waveguide channel is an optical waveguide path perpendicularly extending from the end of the channel to a surface of the printed circuit board. An IC chip mounted on the PCB may include a die flip-mounted on a substrate. An optically transducing surface of the opto-electronic component is directed downward toward the substrate. Optical waveguide paths extend perpendicularly through the substrate, coupling with the optically transducing surfaces. The IC chips are mounted on the PCB, aligning the optical waveguide paths in the substrates with the optical waveguide paths in the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.