Low-stress internal structure for optoelectronic housing

US6736554B2 · kind B2 · utility

Assignee

• Avanex Corporation · US

Inventors

• Sylvaine Kerboeuf · Nozay, FR
• Emmanuel Grard · Saint-Michel-sur-Orge, FR
• Claude Artigue · Bourg-la-Reine, FR
• Pierre J. Laroulandie · Fontainebleau, FR
• Alwin Goeth
• Klaus-Dieter Adam · Jena, DE

Key dates

• Filing date: May 22, 2002
• Grant date: May 18, 2004
• Expiry date: Oct 5, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4239
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In an optoelectronic module (1) comprising a plastics material package (2) accommodating a base (8) fixed to the package (2) and supporting an optical component (9) coupled by an optical fiber (5) to an optical connector (4) of the package (2), fiber displacements associated with thermal stresses are avoided by mounting the base so that it floats on the package (2) and possibly the connector (4). The floating mounting of the base (8) is obtained by using for fixing the base one or more adhesives (13, 14) having a greater elasticity than the adhesives used to fix each of the two ends (6, 7) of the fiber (5) to the base (8) and the connector (4), respectively.