Multi-port modular jack assembly with signal conditioning
US6736673B1 · kind B1 · utility
21Cited by
17References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2003 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Apr 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R24/64
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A stacked jack modular jack assembly is comprised of a multi-port housing including a plurality of jack subassemblies. The jack subassemblies include upper and lower jack housings sandwiching therebetween, a cross-talk shield. The terminal subassembly is substantially Z-shaped, which allows for increased space therebelow for signal conditioning components. The terminal module also includes a center shield and a lower shield, and an outer shield, all of which are commoned together and grounded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.