Patent · US Expired

Adhesive microstructure and method of forming same

US6737160B1 · kind B1 · utility

97Cited by
3References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 23, 2000
Grant dateMay 18, 2004
Priority date
Expiry dateOct 24, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/298
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.