Method of fabricating an image sensor module at the wafer level and mounting on circuit board
US6737292B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an image sensor module applied to a thin image sensor device. A method of fabricating the image sensor module consists of the steps of forming a bump on a glass, attaching the glass to an image sensor at a wafer level, and firstly and secondly dicing the resulting structure. Therefore, the present invention is advantageous in that fabrication of an inferior image sensor module is reduced, thus improving a quality of the image sensor module, productivity of the image sensor module is improved because the image sensor module is fabricated at the wafer level, and a gold wiper process is omitted, thus reducing fabrication costs of the image sensor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.