Patent · US Expired

Thermally stable, weather-resistant polyamide moulding compositions

US6737462B2 · kind B2 · utility

3Cited by
7References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 20, 2001
Grant dateMay 18, 2004
Priority date
Expiry dateApr 27, 2022

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K3/16
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to thermally stable, weather-resistant polyamide moulding compositions containing as stabiliser, a mixture of a copper halide, one or more halogen compounds and hypophosphorous acid or an alkali metal or alkaline earth metal salt of this acid, wherein the individual components of the stabiliser mixture are added in an amount such that the molar amount of halogen contained in the moulding composition is greater than or equal to six times the molar amount of and less than or equal to fifteen times the molar amount of copper contained in the moulding composition and the molar amount of phosphorus is greater than or equal to the molar amount of and less than or equal to ten times the molar amount of copper contained in the moulding composition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.