Thermally stable, weather-resistant polyamide moulding compositions
US6737462B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Apr 27, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to thermally stable, weather-resistant polyamide moulding compositions containing as stabiliser, a mixture of a copper halide, one or more halogen compounds and hypophosphorous acid or an alkali metal or alkaline earth metal salt of this acid, wherein the individual components of the stabiliser mixture are added in an amount such that the molar amount of halogen contained in the moulding composition is greater than or equal to six times the molar amount of and less than or equal to fifteen times the molar amount of copper contained in the moulding composition and the molar amount of phosphorus is greater than or equal to the molar amount of and less than or equal to ten times the molar amount of copper contained in the moulding composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.