Apparatus for laser cutting a workpiece
US6737607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Jul 12, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus is disclosed for cutting a workpiece. A laser beam is directed at successive points along a workpiece surface to be cut and a sensor emits a sensing beam directed at the same successive points as the cutting beam. A beam combining device receives both the sensor beam and the cutting beam and causes downstream beam segments to be collinear with each other as they impinge the workpiece surface. The cutting is thereby able to be carried out in a single pass, and is precise, repeatable and independent of cutting depth, angle of cutting, scoring patterns, material inconsistency, material color, and surface grain variability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.