Micromechanical shock sensor
US6737979B1 · kind B1 · utility
45Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Jun 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0047
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention comprises a micromechanical shock sensor that is formed on the surface of a micro-substrate. A moveable proof mass is formed on the surface with at least one spring connected to the proof mass and the surface. The spring allows the proof mass to move a predetermined distance. Latching means are formed on the surface the predetermined distance from the proof mass. When the sensor is subjected to a sufficient shock, the proof mass moves and contacts the latching means. An indicator means is provided to allow this contact to be readily known by the user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.