Electronic power module and a power component designed to equip such a module
US6738253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Aug 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic power module including at least one semi-conductor power component disposed on an electrically insulating substrate, wherein said semi-conductor power component includes a face in contact with said substrate, which face is metallized in part and is covered in part in a diamond layer, said metallized portion being in contact with a conductor track provided on the surface of the substrate, and said diamond-covered portion being in register with an opening formed in the substrate, said substrate including a face remote from the semi-conductor component which is cooled by a liquid coolant, said liquid flowing into said opening and over the surface of the diamond-covered portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.