Laser based material processing methods and scalable architecture for material processing
US6738396B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Nov 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/2325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.