Method and apparatus for detecting solder paste deposits on substrates
US6738505B1 · kind B1 · utility
40Cited by
5References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 1999 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | May 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting variations in texture in the image to determine a location of the substance on the substrate; and comparing the location of the substance with a desired location. The apparatus includes a screen printer that dispenses a substance at a predetermined location on a substrate, and a machine vision inspection system that includes texture based recognition of the substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.