Method to construct optical infrastructure on a wafer
US6738538B2 · kind B2 · utility
6Cited by
12References
19Claims
0Family size
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Oct 25, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3692
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention discloses a novel method of manufacturing optical communications infrastructures that are implemented on a flat semiconductor wafer. This invention has the following characteristics which enable the efficient manufacturing of a combination of elements onto such a wafer: the inherent surface flatness, crystal purity and uniformity over a relatively large dimension for semiconductor wafers; the low cost and wide availability of such wafers; and the ability to combine several types of elements onto the wafer, on a very dense scale, and in a highly repeatable and mechanically aligned manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.