Dynamic die penetration monitor
US6738729B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B15/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for monitoring die penetration depth of a mechanical press which does not directly measure die penetration depth is disclosed. Actual slide displacement curves under load conditions are continually generated for the press being monitored. The point at which the slide contacts the stock material, the dynamic die bottom dead center point of the slide, and the material thickness are utilized to compute actual die penetration depth. Additionally, theoretical die penetration depth may be calculated using values of theoretical contact point, theoretical bottom dead center and material hardness. Computed values of actual and theoretical die penetration depth as well as corresponding press operational parameters are stored in a database and provide a means of predicting die penetration depth for a particular operational condition of a mechanical press.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.