Molded high impedance surface and a method of making same
US6739028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2001 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Jul 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.