High integration electronic assembly and method
US6739881B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2001 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Nov 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An assembly (20) comprises a circuit board (30), a first component (40), and a second component (50). The circuit board (30) has a planar first surface (32) and a planar second surface (34) opposite the first surface (32). The first component (40) has a first set of connectors (42). The first set of connectors (42) engages a corresponding set of apertures (36) in the first surface (32) of the circuit board (30). The second component (50) has a second set of mechanical one-way connectors (52). The second set of connectors (52) engages a corresponding set of apertures (38) in the second surface (34) of the circuit board (30). The circuit board (30) further has a normal axis (39) perpendicular to both the first and second surfaces (32, 34). The normal axis (39) passes through both the first and second components (40, 50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.