In situ friction detector method and apparatus
US6739947B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 27, 2001 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Apr 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method of using a friction detectors for finishing semiconductor wafers is described. The method uses friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using lubricating films, preferably lubricating boundary layers, in the operative finishing interface. The method can generally aid control of differential lubricating films such as lubricating boundary layers and improve differential finishing of semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing. Defects can be reduced using the in situ friction detector method. Real time improvements to cost of manufacture semiconductor wafer manufacture can be made by tracking and using current in process cost of manufacture parameters. The semiconductor wafers can be tracked individually or by process group such as a process batch. Abrasive finishing surfaces can be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.