Desiccants and desiccant packages for highly moisture-sensitive electronic devices
US6740145B2 · kind B2 · utility
33Cited by
17References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2001 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Sep 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.