Process for fabricating a microelectromechanical optical component
US6740537B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Sep 27, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12104
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for fabricating a microelectromechanical optical component from a silicon substrate is disclosed. The component comprises optical propagation guides; a wall which can move with respect to the propagation guides; and an electrostatic actuator associated with return means formed by at least one beam capable of causing the moving wall to move with respect to the rest of the substrate. The substrate is single-crystal silicon having (111) crystallographic planes parallel to the plane of the substrate. The process comprises a first series of deep reactive ion etching steps during which the heights of the moving wall, of the electrodes of the actuator, and of the beams of the return means of the actuator are defined with different values, and a second wet etching step, making it possible to free the moving wall, the electrodes and the beams from the rest of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.