Method for producing micromachined devices and devices obtained thereof

US6740542B2 · kind B2 · utility

Assignees

• INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE
• EASTMAN KODAK COMPANY · US

Inventors

• Ann Witvrouw · Herent, BE
• Atze de Vries · Seengen, CH
• Piet De Moor · Holsbeek, BE
• Luc Haspeslagh · Dilbeek, BE
• Brigitte Parmentier · Aartselaar, BE
• Agnes Verbist · Leuven, BE
• Constantine N. Anagnostopoulos · Mendon, US

Key dates

• Filing date: Oct 9, 2001
• Grant date: May 25, 2004
• Expiry date: Dec 1, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/973
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The present invention is related to a method for producing micromachined devices for use in Microelectromechanical Systems (MEMS), comprising the steps of providing a crystalline wafer, and processing from said wafer at least one micromachined device comprising at least one elongated opening and/or cavity, having a longitudinal axis, so that said longitudinal axis is at an angle to a direction which lies along the intersection of the front plane of the wafer and a cleavage plane, said cleavage plane being defined as a plane along which cleavage of the wafer is most likely to occur.