Organic compositions
US6740685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | May 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.