Supporting structure for a solid state image sensing device
US6740949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
Abstract
Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.