Composite electronic components
US6741448B2 · kind B2 · utility
7Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2003 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Feb 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dielectric coating, a solid electrolytic layer and a collector layer are provided to one face of a porous valve metal sheet. An insulating section covers this metal sheet including the layers discussed above. Conductive bodies, which are coupled with a first connecting terminal and a second connecting terminal, respectively, are surfaced on at least one face of the insulating section. Connecting bumps are formed on these conductive bodies, so that ICs and other parts are coupled with these bumps. This structure realizes a thin composite electronic component having an excellent high-frequency response.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.