Near-field speaker/microphone acoustic/seismic dampening communication device
US6741718B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A communication device and overmold adapted to minimize the feedback, acoustic coupling, and seismic vibration between a speaker and microphone in close proximity, as is typically found in hands-free headsets, is provided. This invention, through the use of specific structures absorbs unwanted noise and sound waves thereby improving the performance of the communication system as a whole. The complete system of this invention is provided in several embodiments, including an embodiment where the microphone is inserted within the overmold structure, an embodiment where the microphone is a boom microphone and an embodiment where the microphone is somewhat remote (a few inches) down from a miniaturized overmold and is provided with an ON/OFF switch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.