Solder bath with rotatable nozzle
US6742693B2 · kind B2 · utility
4Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0646
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.